Magnet particles and magnet molding using same
US10325705B2 · kind B2 · utility
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2References
13Claims
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Key dates
| Filing date | Aug 24, 2015 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Aug 24, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A bond magnet molding is provided that contains coated magnetic particles having at least two layers of an oxide layer of 1-20 nm on a surface of magnetic particles and an organic layer of 1-100 nm on an outer side of the oxide layer. The bond magnet molding preferably includes a Zn alloy as a binder. The Zn alloy has a strain rate sensitivity exponent (m value) of not less than 0.3 and an elongation at break of not less than 50%. The magnet particles have a nitrogen compound containing Sm and Fe that are solidified using the binder at a temperature not higher than a molding temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.