Image Sensor Device
US10325949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2018 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Aug 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8067
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor device is provided. The image sensor device includes a substrate having a first surface, a second surface, and a light-sensing region. The image sensor device includes a first isolation structure in the substrate and adjacent to the first surface. The first isolation structure surrounds the light-sensing region. The image sensor device includes a second isolation structure passing through the first isolation structure and the substrate under the first isolation structure. The second isolation structure surrounds the light-sensing region and a portion of the first isolation structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.