Connecting a flexible circuit to other structures
US10327332B2 · kind B2 · utility
1Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2016 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Feb 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0776
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.