Applying pressure to adhesive using CTE mismatch between components
US10327343B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2016 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Jul 28, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/752
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.