Enclosure with metal interior surface layer
US10327348B2 · kind B2 · utility
5Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2017 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Apr 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.