Thermal conduction to a cylindrical shaft
US10327357B2 · kind B2 · utility
1Cited by
28References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2014 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Oct 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.