Neural-interface probe and methods of packaging the same
US10327655B2 · kind B2 · utility
3Cited by
23References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Apr 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83191
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.