Patent · US Active

Heat-sensitive recording material

US10328735B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

MITSUBISHI HITEC PAPER EUROPE GMBH · DE

Inventors

Andreas Jagiello · Bielefeld, DE
Matthias Marx · Fürstenfeldbruck, DE
Martin Schreer · Melle, DE

Key dates

Filing date	Jun 24, 2016
Grant date	Jun 25, 2019
Priority date	—
Expiry date	Jun 24, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41M2205/40
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A heat-sensitive recording material has a web-shaped substrate, having a front side and a reverse side opposite the front side, a heat-sensitive recording layer disposed to the front side of the web-shaped substrate, including at least one dye precursor and at least one (color) developer reactive with this at least one dye precursor. A front-side surface of the heat-sensitive recording material is formed dehesively with respect to layers of adhesive applied to the reverse side of the web-shaped substrate. The dehesive front-side surface includes a furnish which is disposed above the heat-sensitive recording layer and comprises at least one release agent. A diffusion layer is formed between the furnish and the heat-sensitive recording layer. A method for producing a heat-sensitive recording material of this kind, and possibilities for its use.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.