Low dusting additive for joint compound
US10329203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Jun 15, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/00672
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive (DRA) that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. More specifically, this dust reduction additive is of sufficiently lighter shade to not impact the shade of the joint compound upon addition. In one embodiment, this invention relates to a non-foaming dust reduction additive that comprises paraffin and/or micro-crystalline wax-based emulsion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.