Patent · US Active

Epoxy resin composition

US10329465B2 · kind B2 · utility

0Cited by

16References

9Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Christian Holtgrewe · Goldkronach, DE
Harald Kuester · Goldkronach, DE
Thomas Bachon · Düsseldorf, DE
Rainer Schoenfeld · Goldkronach, DE

Key dates

Filing date	Jun 19, 2017
Grant date	Jun 25, 2019
Priority date	—
Expiry date	Aug 2, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G2650/50
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to adhesive compositions containing a prepolymer which can be obtained by reacting a reaction mixture containing: at least one epoxy resin; at least one polyetherdiamine or polyethertriamine; at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN); and rubber particles having a core/shell structure. The invention also relates to methods for curing said compositions, to the cured adhesive compositions thus obtained, to the use thereof for bonding components and to the components thus obtained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.