Thermally conductive resin and thermal interface material comprising the same
US10329468B2 · kind B2 · utility
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Key dates
| Filing date | Feb 18, 2016 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Jul 19, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/282
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.