Patent · US Active

Force sensor

US10330540B2 · kind B2 · utility

1Cited by

14References

20Claims

0Family size

Assignee

HONEYWELL INTERNATIONAL INC. · US

Inventors

James F. Machir · Columbus, US
Richard Wade · Worthington, US
Jason Dennis Patch · Columbus, US

Key dates

Filing date	Aug 22, 2017
Grant date	Jun 25, 2019
Priority date	—
Expiry date	Dec 15, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG01L19/147
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A force sensor or sensor assembly may include a sense die, a housing, and a force transmitting member. The sense die may include a force sensing region and at least one bond pad. The housing may include a sense die receiving cavity, at least one electrical terminal configured to engage a bond pad of the sense die, a retention member configured to prevent the sense die from sliding out of the housing, and a hole in the housing that exposes the force sensing region of the sense die to the force transmitting element. The housing may include one or more component parts. In some cases, the force sensor or sensor assembly may be configured on a microscale through micro-manufacturing techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.