Pickoff transducer wire bond bit detection
US10330719B2 · kind B2 · utility
1Cited by
1References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2014 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Jul 22, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D18/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device includes at least two transducers, a sensor signal processing circuit, and a transducer to sensor signal processing circuit electrical connections, each connecting a respective one of the transducers to the sensor signal processing circuit. The device also includes a differential amplifier connected with two bond wires, the bond wires connected to the differential inputs of the differential amplifier and the amplifier output connected to the sensor signal processing circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.