Magnetic field sensor with coil structure and method of fabrication
US10330741B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Feb 20, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/098
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method includes forming first coil segments in an electrically conductive layer of an active silicon substrate, forming a magnetic sense element over an electrically insulating layer of the active silicon substrate, the magnetic sense element being separated from the first coil segments in the electrically conductive layer by the electrically insulating layer. A protective layer is formed over the magnetic sense element. Conductive vias are formed extending through the protective layer and the electrically insulating layer to electrically couple with the first coil segments, and second coil segments are formed over the protective layer, the second coil segments electrically coupling with the conductive vias to produce a coil structure of the first coil segments, the conductive vias, and the second coil segments, with the coil structure surrounding the magnetic sense element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.