Automated electronic component footprint setup system and a method thereof
US10331847B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Aug 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2115/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An automated electronic component footprint setup system and a method thereof are provided in the present disclosure. The system is available to not only an external first user for configuring characteristic parameters of an electronic component for the database but also an external second user for configuring setup parameters of an electronic component footprint to be created. Then, the system is to create an electronic component footprint of a specific electronic layout system according to the characteristic parameters of the electronic component, component setup regulations and the setup parameters, all of which correspond to the electronic component footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.