Semiconductor device and method of manufacturing semiconductor device
US10332826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2014 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Mar 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a plurality of solder balls on a surface the semiconductor device, and a retaining body associated with a first solder ball of the plurality of solder balls, separating the first solder ball from at least a second solder ball of the plurality of solder balls. The retaining body includes a conductive portion and an insulating portion configured to cover the conductive portion. Also, a method of manufacturing a semiconductor device, including acts of forming a plurality of retaining bodies on a surface of a wiring substrate, each retaining body comprising a conductive portion and an insulating portion covering the conductive portion, each retaining body forming an opening section, and forming a solder ball in the opening section formed by each of the retaining bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.