Optoelectronic light-emitting component and leadframe assemblage

US10333032B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Frank Möllmer · Bad Abbach, DE
• Markus Arzberger · Sunnyvale, US
• Michael Schwind · Sinzing, DE
• Thomas Hofer · Auenwald, DE
• Martin Haushalter · Regensburg, DE
• Mario Wiengarten · Geesthacht, DE
• Tilman Eckert · George Town, MY

Key dates

• Filing date: Aug 8, 2014
• Grant date: Jun 25, 2019
• Expiry date: Aug 8, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.