Headphone pivot joint
US10334352B2 · kind B2 · utility
0Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Dec 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/1008
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An earcup to headband joint for headphones, wherein the headphones comprise an electrical cable that extends from the headband into the earcup. The earcup to headband joint includes joint structure that couples the earcup to the headband and that is constructed and arranged to provide for earcup translation along a vertical axis and rotation about the vertical axis, and at least one friction element in the earcup and in contact with at least one of the joint structure and the cable. The friction element is constructed and arranged to provide forces that resist rotational motion of the earcup about the vertical axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.