Cooling methods for electronic components
US10334757B2 · kind B2 · utility
1Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2016 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.