Method of venting heated air from electronic equipment enclosure
US10334761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2018 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Nov 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.