Method for providing cooling to electronic racks using liquid cooling and air cooling
US10334763B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Nov 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20818
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic rack includes computing nodes arranged in a stack. Each computing node includes electronics which are liquid cooled using liquid cold plates and air cooled using fans. The electronic rack further includes cooling fans, each corresponding to a computing node to provide air cooling to the computing node. The electronic rack further includes a pair of rack supply manifold and rack return manifold, and an air-to-liquid (A/L) heat exchanger. The rack supply manifold receives cooling liquid from a coolant distribution unit (CDU). The rack return manifold receives and returns warmer liquid carrying the heat back to the CDU. The A/L heat exchanger is connected to the rack liquid supply. The rack supply manifold receives the cooling liquid from the A/L heat exchanger, then to distribute the cooling liquid to each computing node to provide liquid cooling to processors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.