Ultrasonic probe
US10335830B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2016 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Aug 31, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to one embodiment, an ultrasonic probe includes piezoelectric elements, a flexible printed circuit, and one of an air gap layer and a resin layer. The piezoelectric elements transmit and receive ultrasonic waves. The flexible printed circuit located on a rear surface side of the piezoelectric elements and electrically connected to the piezoelectric elements. The air gap layer locates on a rear surface side of the flexible printed circuit and has air gaps. The resin layer is obtained by filling the air gap layer with a resin and locates on the rear surface side of the flexible printed circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.