Clamping device for soldering operations
US10335903B2 · kind B2 · utility
0Cited by
11References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 28, 2016 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Oct 14, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.