Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method
US10336708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2015 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Dec 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/032
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.