Diffusion pump to supply heat from a condenser to a heating element
US10337531B2 · kind B2 · utility
0Cited by
9References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2015 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04F9/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A diffusion pump is provided that includes a housing and a boiling chamber connected to the housing. The boiling chamber has a heating element. The housing has a nozzle that is connected to the boiling chamber. The housing also has a condenser is arranged at an internal surface, where the condenser has a cooling system. The boiling chamber is thermally isolated from the condenser by an isolator. The cooling system is at least partially a water cooling system and is connected to the heating element via a heat pump such that heat from the condenser is supplied to the heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.