Multi-channel optical subassembly structure comprising an alignment jig and method of packaging the structure
US10338326B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Sep 20, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4284
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.