Method and device for grooving wafers
US10340170B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2016 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Aug 30, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer grooving apparatus (100) for forming an elongate recess (103) in a semiconductor wafer surface, the apparatus comprising:a wafer table (110) for receiving and holding a semiconductor wafer;a radiation device (120) for generating a radiation beam (121);a beam directing device (130) for directing the radiation beam to a top surface (102) of the wafer so as to create a beam spot (142) where the radiation beam ablates wafer material on the wafer surface to form a recess;a wafer table displacement drive (170) for effecting a mutual displacement between the radiation beam and the wafer surface in a radiation beam displacement direction;a recess profile measuring device (180) arranged at a predetermined distance behind the beam directing device in the radiation beam displacement direction effected by the wafer table displacement drive for measuring a depth profile of the recess that has been formed by the radiation beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.