Electronic device and method of manufacturing the same
US10340682B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Oct 5, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.