Bonded substrate, surface acoustic wave element, surface acoustic wave device, and method of manufacturing bonded substrate
US10340881B2 · kind B2 · utility
2Cited by
1References
11Claims
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Key dates
| Filing date | Feb 3, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Nov 10, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.