Distributed transistor-based power supply for supplying heat to a structure
US10342074B2 · kind B2 · utility
0Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2013 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Jul 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2206/023
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heating system includes a structure to be heated, and a heating apparatus disposed to heat the structure. The heating apparatus includes a housing member, a plurality of resonant frequency power sources, and a plurality of associated controls. The plurality of resonant frequency power sources are attached to the housing member. The plurality of associated controllers is configured to separately operate the plurality of resonant frequency power sources at resonant frequencies matching heating requirements of the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.