Liquid cooling device and electronic device applying the liquid cooling device
US10342158B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20281
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid cooling device, which is used for performing heat dissipation to switching chips and optical modules in the electronic device, and comprises: a first cooling plate attached to the switching chip and used for performing heat dissipation to the switching chip; a second cooling plate attached to the optical module and used for performing heat dissipation to the optical module; an air-liquid heat exchanger used for containing cooling liquid and performing cooling to backflow cooling liquid through cooling air; a transmission pipe used for sequentially transmitting the cooling liquid flowing out from the air-liquid heat exchanger to the first cooling plate and the second cooling plate, which then flows back to the air-liquid heat exchanger; and a power device used for controlling the cooling liquid in the transmission pipe to be sequentially transmitted to the first cooling plate and the second plate and then flow back.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.