Implantable electrode array assembly with an array substrate, electrodes and packaged integrated circuits

US10342971B2 · kind B2 · utility

Assignee

• Stryker Corporation · US

Inventors

• John J. Janik · Hudsonville, US
• Robert Brindley · Delton, US
• Edward Chia Ning Tang · Menlo Park, US
• James Bernard Dunlop · Colorado Springs, US
• Leland Joseph Spangler · Ann Arbor, US

Key dates

• Filing date: Jul 16, 2018
• Grant date: Jul 9, 2019
• Expiry date: Jul 16, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.