Method for wafer-level manufacturing of objects and corresponding semi-finished products
US10343899B2 · kind B2 · utility
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Key dates
| Filing date | Oct 1, 2012 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Jan 8, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/18
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub-wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.