Composition for polishing silicon wafers
US10344185B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 17, 2015 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Jun 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a composition for polishing silicon wafers, having an excellent effect of reducing haze and having low agglomerating property. A composition for polishing silicon wafers provided here includes: an amido group-containing polymer A; and an organic compound B not containing an amido group. The amido group-containing polymer A has, on a main chain, a building block S derived from a monomer represented by General Formula (1). Molecular weight MA of the amido group-containing polymer A and molecular weight MB of the organic compound B have a relation satisfying 200≤MB<MA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.