Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
US10344385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2014 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Aug 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09009
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom.The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing titanium dioxide (TiO2); forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.