Patent · US Active

Bonded structure, method for manufacturing the same, and bonding state detection method

US10345515B2 · kind B2 · utility

0Cited by
9References
18Claims
0Family size

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Key dates

Filing dateJan 6, 2016
Grant dateJul 9, 2019
Priority date
Expiry dateJan 6, 2036

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2605/18
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The purpose of the present invention is to provide a bonded structure, a method for manufacturing the same, and a bonding state detection method which are capable of determining whether or not members are bonded together appropriately. A bonded structure 10 includes a laminated sheet 12A, a laminated sheet 12B, an adhesive 14 that bonds the laminated sheet 12A and the laminated sheet 12B together, and a distributed optical fiber 16 sandwiched between the laminated sheet 12A and the laminated sheet 12B. The cross-sectional shape of the distributed optical fiber 16 is deformed in accordance with the bonding state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.