Thinned and flexible circuit boards on three-dimensional surfaces
US10345619B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Mar 19, 2015 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Mar 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02C7/049
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Thinned, flexible surface regions upon which flexible active components may be utilized to attach flexible active components in space/volume constrained devices, for example, a powered ophthalmic device. Thinned, flexible surface regions foster an avenue for enhanced functionality because various electronic circuits and components can be integrated into polymeric structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.