Predictive failure of hardware components
US10346239B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2016 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Aug 15, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2201/81
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system is described wherein power degradation can be used in conjunction with predictive failure analysis in order to accurately determine when a hardware component might fail. In one example, printed circuit boards (PCBs) can unexpectedly malfunction due to a variety of reasons including silicon power variation or air mover speed. Other hardware components can include silicon or an integrated circuit. In order to accurately monitor the hardware component, telemetry is used to automatically receive communications regarding measurements of data associated with the hardware component, such as power-related data or temperature data. The different temperature data can include junction temperature or ambient air temperature to determine an expected power usage. The actual power usage is then compared to the expected power usage to determine whether the hardware component can soon fail.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.