Configuring signal devices in thermal processing systems
US10346647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2018 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Jan 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/3494
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.