Semiconductor package
US10347551B2 · kind B2 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2017 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Sep 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprises a resin material, a semiconductor chip in the resin material, and a metal member in the resin material. The metal member has a first surface that faces the semiconductor chip and a second surface that is opposed to the first surface. The first surface of the metal member has a plurality of first recess portions formed thereon. The first recess portions extend into the metal member and have an opening width that is less than a bottom width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.