Electronic device and method for manufacturing electronic device
US10347555B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 26, 2016 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Dec 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/564
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device has a substrate 10, an electronic element 80 provided on the substrate 10 and a sealing part 20 for sealing the electronic element 80. The sealing part 20 has an insertion part 22 for inserting a fastening member 90. The insertion part 22 is provided in a sealing recessed part 25 recessed compared with a circumferential region. At least side surface and the sealing recessed part 25 of the sealing part 20 are exposed to the outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.