Semiconductor package device

US10347570B2 · kind B2 · utility

Assignee

• ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG, TAIWAN

Inventor

• Hsun-Wei Chan

Key dates

• Filing date: Dec 30, 2016
• Grant date: Jul 9, 2019
• Expiry date: Dec 30, 2036

Classification

• Technology area (CPC —): General

Abstract

An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.