Composite antenna substrate and semiconductor package module
US10347598B2 · kind B2 · utility
14Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Mar 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.