Method of fabricating an optical module that includes an electronic package
US10347615B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2015 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Jun 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/52
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.