Patent · US Active

Semiconductor packaging structure and semiconductor power device thereof

US10347758B2 · kind B2 · utility

0Cited by

1References

12Claims

0Family size

Assignee

Delta Electronics, Inc. · TW

Inventors

Chao Cai · Los Altos Hills, US
Jian-Hong Zeng · Shanghai, CN
Zeng Li · Pudong New District, CN

Key dates

Filing date	Jul 12, 2017
Grant date	Jul 9, 2019
Priority date	—
Expiry date	Jul 12, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10D64/256
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor packaging structure includes a chip, a first pin, a second pin, and a third pin. The chip includes a first surface, a second surface, a first power switch, and a second switch, and both the first power switch and the second switch include a first terminal and a second terminal. The second surface of the chip is opposite to the first surface of the chip. The first pin does not contact to the second pin. The first terminal of the first power switch of the chip is coupled to the first pin, and the second terminal of the first power switch of the chip is coupled to the third pin. The first terminal of the second power switch of the chip is coupled to the third pin, and the second terminal of the second power switch of the chip is coupled to the second pin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.