Patent · US Active

Header flange to evenly distribute contact pressure across seals

US10347921B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignees

GM GLOBAL TECHNOLOGY OPERATIONS LLC · US
HONDA MOTOR CO., LTD. · JP

Inventors

Liang Xi · Northville, US
Xi Yang · Bloomfield Hills, US
Ishida Kentaro · Tokyo, JP
Siguang Xu · Rochester Hills, US
Satoshi Oyama · Nanbu, JP
Yu Tomana · Wako, JP
Richard D. Blakeley · Ortonville, US

Key dates

Filing date	Feb 17, 2017
Grant date	Jul 9, 2019
Priority date	—
Expiry date	Aug 12, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E60/50
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Systems and methods including a header flange to evenly distribute contact pressure across seals include, in some aspects, a plate including a bead and a flange edge. The bead includes a bead-side and a bead-corner. The flange edge defines an aperture through the plate. The flange edge also includes a first edge-portion proximate the bead-side and a second edge-portion proximate the bead-corner. The bead-side and the first edge-portion define a first edge-distance therebetween. The bead-corner and the second edge-portion define a second edge-distance therebetween. The second edge-distance is greater than the first edge-distance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.