Multi-frequency guided wave devices and fabrication methods
US10348269B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2015 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Aug 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/027
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A micro-electrical-mechanical system (MEMS) guided wave device includes a piezoelectric layer including multiple thinned regions of different thicknesses each bounding in part a different recess, different groups of electrodes on or adjacent to different thinned regions and arranged for transduction of lateral acoustic waves of different wavelengths in the different thinned regions, and at least one bonded interface between the piezoelectric layer and a substrate. Optionally, a buffer layer may be intermediately bonded between the piezoelectric layer and the substrate. Methods of producing such devices include locally thinning a piezoelectric layer to define multiple recesses, bonding the piezoelectric layer on or over a substrate layer to cause the recesses to be bounded in part by either the substrate or an optional buffer layer, and defining multiple groups of electrodes on or over the different thinned regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.