Multilayer circuit board and method of manufacturing the same
US10349533B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 29, 2018 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Dec 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0776
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.