Metallurgically bonded gold pocket pad for grounding an EMI filter to a hermetic terminal for an active implantable medical device
US10350421B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2018 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Apr 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0042
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.