Mold assemblies that actively heat infiltrated downhole tools
US10350672B2 · kind B2 · utility
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18References
7Claims
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Key dates
| Filing date | Dec 2, 2014 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Jun 24, 2035 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/55
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An example mold assembly for fabricating an infiltrated downhole tool includes a mold forming a bottom of the mold assembly, and a funnel operatively coupled to the mold. An infiltration chamber is defined at least partially by the mold and the funnel to receive and contain matrix reinforcement materials and a binder material used to form the infiltrated downhole tool. One or more thermal elements are positioned within at least one of the mold and the funnel, and the one or more thermal elements are in thermal communication with the infiltration chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.